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| 3.2X1.6mm SMD CHIP LED LAMP APK3216MBC BLUE Features !3.2mmX1.6mm SMT LED, 1.1mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS !PACKAGE Description The Blue source color devices are made with GaN on SiC Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. COLORS AND LENS TYPES AVAILABLE. :2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO:DSAD1153 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN:L.ZHANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20m A Min . APK3216MBC BLUE (GaN) WATER CLEAR 7 Ty p . 18 V i ew i n g An g l e 21/2 90 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Blue Blue Blue Blue Blue Blue D ev i c e Ty p . 430 466 60 100 3.8 4.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s I F =2 0 mA I F =2 0 mA I F =2 0 mA V F= 0 V ; f = 1 M H z I F =2 0 mA V R = 5V Absolute Maximum Ratings at T)=25C Par am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating / Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. B lu e 10 5 30 150 5 -40C To +85C Un it s mW mA mA V SPEC NO:DSAD1153 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN:L.ZHANG PAGE: 2 OF 4 Blue APK3216MBC SPEC NO:DSAD1153 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN:L.ZHANG PAGE: 3 OF 4 APK3216MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO:DSAD1153 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN:L.ZHANG PAGE: 4 OF 4 |
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